Analysis of the grain boundary precipitates in stainless steel by potentiostatic etching dissolution method

Park, Shin Hwa; 박신화; An, Byug Ryang; 안병량; Hong, Ki Jung; 홍기정; Lee, Do Hyung; 이도형

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P-ISSN1225-0163
E-ISSN2288-8985
SCOPUS, ESCI, KCI

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P-ISSN 1225-0163
E-ISSN 2288-8985

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Vol.6, No.2

PubReader Citation

Analysis of the grain boundary precipitates in stainless steel by potentiostatic etching dissolution method

Analytical Science and Technology / Analytical Science and Technology, (P)1225-0163; (E)2288-8985

1993, v.6 no.2, pp.157-165

Park, Shin Hwa
An, Byug Ryang
Hong, Ki Jung
Lee, Do Hyung

Park, S. H., An, B. R., Hong, K. J., & Lee, D. H. (1993). Analysis of the grain boundary precipitates in stainless steel by potentiostatic etching dissolution method. , 6(2), 157-165.

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Abstract

The potentiostatic etching dissolution method, which had been used for the quantification of precipitates in steel, was applied to investigate the origin of cracks occurred in 304 stainless steel during processing. The morphology of crack propagation was observed by SEM. EDS and EPMA were used for the analysis of chemical composition of large precipitates on the grain boundary. The crystal structure of these large precipitates was determined by X-ray diffraction and electron diffraction. In both a stainless steel plate and a wire, the crack propagated along the grain boundary. Large precipitates on the grain boundary were identified to be $M_2C$ and $M_{23}C_6$. Potentiostatic etching dissolution method was found to be appropriate to the sample preparation for the analysis of precipitates in stainless steel.