AES Analysis of Au, Au/Cr, Au/Ni/Cr and Au/Pd/Cr Thin Films by the Change of Substrate Temperature and Annealing Temperature

Yoo, Kwang Soo; 유광수; Jung, Hyung Jin; 정형진

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P-ISSN1225-0163
E-ISSN2288-8985
SCOPUS, ESCI, KCI

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P-ISSN 1225-0163
E-ISSN 2288-8985

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Vol.6, No.2

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AES Analysis of Au, Au/Cr, Au/Ni/Cr and Au/Pd/Cr Thin Films by the Change of Substrate Temperature and Annealing Temperature

Analytical Science and Technology / Analytical Science and Technology, (P)1225-0163; (E)2288-8985

1993, v.6 no.2, pp.217-223

Yoo, Kwang Soo
Jung, Hyung Jin

Yoo, K. S., & Jung, H. J. (1993). AES Analysis of Au, Au/Cr, Au/Ni/Cr and Au/Pd/Cr Thin Films by the Change of Substrate Temperature and Annealing Temperature. , 6(2), 217-223.

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Abstract

Thin films of the Au/Cr, Au/Ni/Cr and Au/Pd/Cr systems were deposited on alumina substrates at ambient temperature and $250^{\circ}C$ in a high-vacuum resistance heating evaporator and annealed at $300^{\circ}C$, $450^{\circ}C$ and $600^{\circ}C$ for 1 hour in air, respectively. The film thicknesses of Au, Ni(or pd), and Cr were $1000{\AA}$, $300{\AA}$, and $50{\AA}$, respectively. The substrate temperature during deposition and the post-deposition annealing temperature affected the sheet resistance of thin-films due to the inter-diffusion of each layer. As a result of Auger depth profile analysis, in the Au/Cr system Cr already diffused out to Au surface during deposition at the substrate temperature of $250^{\circ}C$ and Au distribution changed after heat treatment. In the Au/Ni/Cr and Au/Pd/Cr systems, diffusion phenomena of Ni and Pd were found and especially Ni (approximately 45 at.%) diffused out to Au surface and oxidized.